CTI PRO established cooperation with major telco equipment brokers. We are offering hardware from most major OEM’s including:
| 3com | Aastra | Aculab |
| ADC | Adtran | Afc |
| Agilent | Alcatel | Argus |
Allo.com - Dialogic - Digium - Dinstar Technologies - Epygi - King Young - Lancom - Media 5 - OpenVox - Sangoma - Synway - Tecnoware - VoLANs - Zycoo
Amtelco XDS
Amtelco overview
AMTELCO is a trusted name in call center communication systems, software applications and XDS technologies for call centers, contact centers, healthcare facilities, higher education facilities, executive suites and developers. AMTELCO also designs, manufactures and markets a wide variety of PC, PCI and CompactPCI switching boards to specialized computer-based development companies throughout the world.
XDS Technology
AMTELCO XDS Technology offers a number of H.100 PCI products that have been used in a wide array of telecommunications applications. High-density Basic Rate Interface boards can be used for terminal, network, and PBX interfacing. MC-3 multi-chassis technology offers reliable, fault tolerant connections between large numbers of telephony servers. Conferencing solutions allow adjustable gains, DTMF detection and filtering, and dynamic switching. Analog line interface boards are available with Station interfaces for connecting to standard telephones, 2/4-wire E&M interfaces for connection to additional PBXs or wireless transmitters, and loop start interfaces for Central Office trunks. The new XDS H.100 T1/E1/J1 board offers a powerful solution for applications requiring cost-effective digital interfaces by accommodating up to eight digital spans in a single PCI card slot.
XDS MC-3 Multi-Chassis Interconnect Boards
The standard AMTELCO XDS MC-3 H.110 CompactPCI, H.100 PCI and MVIP MC-3 Multi-Chassis Interconnect boards provide fully dynamic timeslot switchimg between 20+ chassis. Configuring the bus in a non-redundant extended mode alows for system expansion to 4 846 non-blocking timeslots betweeneither local or off-site locations, allowing up to 2 423 full duplex connections. The standard XDS MC-3 H.110 CompactPCI, H.100 PCI and MVIP MC-3 boards are equipped with enhanced conferencing capability, DTMF tone detection and DTMF tone clamping, which prevents DTMF tones from distributing conference participants. Up to 128 ports may be combined in up to 42 simultaneous conferences, depending on specific user needs. Conference input levels and thresholds are controlled by software. AMTELCO also offe two XDS H.100 PCI MC-3 boards for basic configurations without conferencing: XDS H.100 PCI MC-3 Lite Multi-Chassis Interconnect board XDS H.100 PCI MC-3 UltraLite Multi-Chassis Interconnect board These two boards offer a reduced cost multi-chassis solution in applications that do not require conferencing.
XDS H.100 PCI MC-3 UltraLite Multi-Chassis Interconnest Board
This board is ideal for expanded applications that need to provide communication between as many as five chassis, with fully dynamic timeslot switching from one chasssis to another. The MC-3 UltrLite board uses a single OC3 fiber optic ring, and can connect between chassis with adjacent chassis located up to 2 000 meters apart. Board includes a total of 2 423 timeslots, allowing up to 1 211 full-duplex connections between either local or off-site locations. Driver support for Windows NT, Windows 2000, UnixWare and Linux is available.
XDS SCSA SCx Multi-Chassis Interconnect Board
Up to six PC chassis may be connected together with the use of this board. Multi-Chassis Interconnect Board provides SCSA system expansion and switching to maximum of 1 344/1 536 ports in a non-blocking arrangement. Up to 512 external ports per chassis per board are available. The chassis are assigned to the SCx bus in 64 port increments. Board is ideal for building large multi-chassis systems, or for bulding large single-chassis systems. DOS, OS/2, Linux, UnixWare and Windows NT drivers are available.
Find out complete description of each product in our product section.
